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TSMC 3nm is in demand,rumored that the U.S. customers are busy with capacity

12/03/2021 TSMC, foundry, Intel, 5G mobile chips, HPC chips

TSMC 3nm is in demand,rumored that the U.S. customers are busy with capacity


  The leading foundry TSMC 3nm process (N3) will be in mass production in the second half of 2022, and the outside world is highly concerned about the progress of the new generation process and customer adoption. Supply chain news said that important U.S. customers' products will officially enter the trial production stage in December, and even Intel executives are planning to meet with the company in the near future, with the aim of actively taking care of production capacity to ensure that the next generation of products can be successfully launched.

  TSMC's new 3nm plant in Nanke has officially opened this summer, and according to the news revealed at the recent law conference, N3 is expected to enter mass production in the second half of 2022, and compared to 5nm (N5), there will be more new product designs finalized in the first year (Tape-out), and the first quarter of 2023 will see a significant contribution to revenue; N3E will also be launched as an extension of N3. The initial estimate of the mass production schedule will be in the year after the mass production of N3 (i.e., the second half of 2023).

  Supply chain sources pointed out that TSMC planning 3nm monthly first wave production capacity target of 50,000 to 60,000 pieces, in March next year there will be 30,000 to 40,000 pieces in place, will be grabbed by Apple, scheduled in December this year to January next year into the product trial production, mainly locked in 2022 new machines. And the first wave of customers on the list of Intel, next year's new generation of products will be imported into TSMC 3nm and 4nm process.

  Recently, market news pointed out that Intel will hold a semiconductor supplier summit in mid-December, and the company's senior management also plans to meet with TSMC. The industry pointed out that Intel is not only delayed in the process, but is also being pushed by rivals in the market, so the competitiveness of the next generation of products is very important, and must rely on external resources to help recapture market share.

  TSMC pointed out at the meeting that 5G mobile chips and HPC chips will be the main products to be invested in the first year of 3nm mass production. It is understood that in addition to Apple and Intel, they are included in the first wave of N3 cooperation list, including MediaTek, Super Power, Qualcomm, Nvidia and others are also planned to follow. The legal person is optimistic that TSMC 3nm is still the most competitive process for the next generation, coupled with the demand for 3nm or more process to maintain a high grade, it is expected to write a new high in revenue next year and the year after.



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